THRCND
| (Material data) |
|---|
| Last updated on : 09-08-2013 |
THRCND Material, Ftype, Conductivity
or
THRCND Material, Ftype, Ndata
Temp(1), Conductivity(1)
::
Temp(Ndata), Conductivity(Ndata)
or
THRCND Material, Ftype, N1, N2
Temp(1) .. Temp(Ndata)
Atom(1) .. Atom(Ndata)
| OPERAND | DESCRIPTION | DEFAULT |
|---|---|---|
| Material | Material number | None |
| Ftype | Function type: 0 = Constant thermal conductivity 1 = Temperature dependent thermal conductivity 2 = Density dependent thermal conductivity () 3 = Atom dependent thermal conductivity () 4 = Temperature and Atom dependent thermal conductivity (*) | None |
| Conductivity | Thermal conductivity | None |
| N1 | Number of data pairs for the function or temp. data for method = 4 | Â |
| N2 | Number of atom data for method = 4 | Â |
| Ndata | Number of temp/thermal conductivity data pairs | None |
| Temp(i) | Temperature of ith data pair | None |
| Conductivity(i) | Thermal conductivity of ith data pair | None |
| Density(i) | Density dependent thermal conductivity | None |
| Atom(i) | Atom dependent thermal conductivity | None |
DEFINITION
THRCND specifies the thermal conductivity of a particular material.
REMARKS
The thermal conductivity may be specified as a constant value as a set of discrete temperature/conductivity data pairs. If Ftype = 0 use the operand Conductivity. If Ftype = 1 use the operands Ndata, Temp(i), Conductivity(i). Each temperature/thermal conductivity pair should be provided on a separate line. When temperatures lie within the specified data range, linear interpolation is used to determine the corresponding thermal conductivity. When temperatures lie outside the specified data range, linear extrapolation is used to determine the corresponding thermal conductivity. If Ftype = 2 use the operands N1 and Density (i). If Ftype = 3 use the operands N1 and Atom(i). It should be noted that the atom variables means the weight percent of solute in the material. If Ftype = 4 use the operands N1, N2, Temp (i), Atom (i). The equation for heat conduction is: | 
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Applicable simulation types:
Deformation Module, Heat Transfer, Non-Isothermal Deformation, Microstructure Module.
RELATED TOPICS
Material Data: Thermal Data Keywords: HEATCP, EMSVTY, MASDEN